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Three layers electrodes ' protection , have good solderability .

三层电极保护，可焊性好。

The non-bright tin deposit has good solderability after sealing .

封闭后的雾面锡镀层仍有良好的可焊性。

Effects of pulse current on solderability of acidic tin electroplating

脉冲参数对可焊性镀锡层性能的影响

The solderability of SiC p / Al composite materials is improved by electroless Ni-P alloy plating on its surface .

采用在高体分碳化硅增强铝基复合材料表面化学沉积NiP合金镀层的方法来改善焊接性能。

Tin and its alloy electroplating have been widely adopted in electronic industry for their excellent corrosion resistance and solderability .

锡及其合金由于优良的耐蚀性和可焊性而广泛应用于电子工业中。